LipiWorld 30gm Grey Heat Sink Compound Thermal Silicone Conductive Grease Paste Use in Coolers Heat for PC CPU GPU Graphics Card Chipset (Pack of 2) Carbon Based Thermal Paste(60 g 1.93 W/mK)
LipiWorld

LipiWorld 30gm Grey Heat Sink Compound Thermal Silicone Conductive Grease Paste Use in Coolers Heat for PC CPU GPU Graphics Card Chipset (Pack of 2) Carbon Based Thermal Paste(60 g 1.93 W/mK)

Deal score 100/100· Excellent deal61% off MRP· Near 90-day low

Based on current discount vs MRP and price history — not product quality reviews.

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In stock
₹197
61% off
₹499
Updated 36d ago
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All-time low: ₹197 (last 90 days)

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About this product

This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency, very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler. Safe Application: It does not contain any metallic particles so electical conductivity would not be an issue. Unlike silver and copper compound, it ensures that get with any electrical pins would not result in damage of any sort. High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. A high performance thermal compound perfect for system builders. Color: Grey Thermal Conductivity: 1.93W/ m-k Thermal resistance: 0.225 Operating temperature: -30 to 180 Celsius Weight: 30g Shelf Life: Two years Notice : Thermal conductivity : 0.965 W/m-k Thermal resistance : 0.225° C-in /W Working temperature range: - 30. Package Includes: 2 x ? Thermal Heat Sink Grease Paste

Specifications

General

Brand
LipiWorld
Composition
Aluminium Oxide, Zinc Oxide
Model Name
30gm Grey Heat Sink Compound Thermal Silicone Conductive Grease Paste Use in Coolers Heat for PC CPU GPU Graphics Card Chipset (Pack of 3)
Model Number
30gm Grey Heat Sink Compound Thermal Silicone Conductive Grease Paste Use in Coolers Heat for PC CPU GPU Graphics Card Chipset (Pack of 3)
Net Quantity
90 g
Product Id
TRPG6JEFH2W4DMHK
Quantity
90 g
Thermal Conductivity
1.93 W/mK
Type
Carbon Based
Viscosity
200 Pa-s

Additonal Features

Key Features
Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently., With an ideal consistency, is very easy to use, even for beginners. Once applied, you do not need to apply it again as it will last at least for years., It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, thereby increasing the overall efficiency of the component / device

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