PAUS&MORK

PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK)

Name: PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK)
Brand: PAUS&MORK
Price: 466.00 INR
Availability: InStock

Deal score 100/100· Excellent deal53% off MRP· Near 90-day low

Based on current discount vs MRP and price history — not product quality reviews.

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₹466

53% off

₹999

Updated 36d ago

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All-time low: ₹466 (last 90 days)

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About this product

•Place over the area you want to protect from hot air and Fits for PCB, Mother board, electronics board, IC SMD DIP and etc.•Great safety and stability: electrical insulation, in -40 C - 200 C will not melt. Wear Resistant, anti-static, fire retardant, buffering, no toxic, odorless, no corrosion, no stimulation, heat conducting silica gel.•Packed with 100 thermal pads, Pre-cut pads for easy placement. Size: 12mm * 12mm * 1.5mmEasy Installation1. Remove the old heat-conducting material, clean the surface2. Tear off the protective films on both sizes3. Exert certain pressure to make it with good contacts with both surfaces • Thermal Silicone Pads

Specifications

General

Key highlights: CPU Fever Patch
Additional details: CPU Fever Patch
Brand: PAUS&MORK
Composition: 0
Model Name: Pre-Cut CPU Fever Patch Silicone Pads for Mobile Motherboard IC Chip CPU Cooling
Model Number: Pre-Cut CPU Fever Patch Silicone Pads for Mobile Motherboard IC Chip CPU Colling
Net Quantity: 50 g
Product Id: TRPHAHNU2Z3SEGPV
Quantity: 50 g
Thermal Conductivity: 0 W/mK
Type: Ceramic Based
Viscosity: 0 Pa-s

Additonal Features

Key Features: The heatsink silicone pad can quickly fill electronic components, tiny gaps that rapidly conduct and dissipate heat generated by high-power CPUs/GPUs, High pressure and high temperature resistant safe and stable, Strong heat conduction and heat dissipation, Strong insulation and comprehensive protection, Escort for electronic equipment, excellent heat dissipation, worry-free insulation, suitable for Apple, Android phones, high-power LED modules, Integrated chips, and other scenarios
Other Features: Size: 17mm * 15mm * 1.5mm

PAUS&MORK Pre-Cut Thermal Silicone Pads for Mobile Motherboard IC Chip CPU Colling- 100pcs Ceramic Based Thermal Paste(10 g 6 W/mK)

Shipping & returns (retailer)

Kaisa community rating

90-day price history

About this product

Specifications

General

Additonal Features

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