Ranz Carbon Based Heat Sink Compound for PC,CPU,GPU,Chipset,VGA,LED,Processor,Ovens Carbon Based Thermal Paste(20 g 1.93 W/mK)
Ranz

Ranz Carbon Based Heat Sink Compound for PC,CPU,GPU,Chipset,VGA,LED,Processor,Ovens Carbon Based Thermal Paste(20 g 1.93 W/mK)

Deal score 100/100· Excellent deal53% off MRP· Near 90-day low

Based on current discount vs MRP and price history — not product quality reviews.

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In stock
₹142
53% off
₹299
Updated 36d ago
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All-time low: ₹142 (last 90 days)

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About this product

Ranz Thermal grease G-360 20 gram,Thermal paste compound 20 gram, GPU Heatsink paste 20 G,paste for CPU,VGA,LED,Chipset,Processor and other Pc components. Ranz Thermal Paste is a thermal compound used to improve heat transfer between a processor and a heat sink. It is a thick, paste-like substance that fills the microscopic gaps between the two surfaces, allowing heat to flow from the processor to the heat sink more easily. This helps to keep the processor cool and prevent it from overheating. Features:- High stability and reliability Apply to CPU,VGA,LED,Chipset,Processor and other Pc components. Low thermal resistance High conductivity for heat transfer Compliance with RoHS REACH PFOS requirements Thermal conductivity:>1.96W/m-k Thermal resistance:<0.225 °C-in ²/W Model:- G-360 Type:- Carbon based Composition:- Aluminium Oxide,Zinc Oxide Quantity:- 20 Gram Colour:- Grey • low viscosit • High thermal conduct • non-conduct

Specifications

General

Key highlights
low viscosit · High thermal conduct · non-conduct
Additional details
low viscosit | High thermal conduct | non-conduct
Brand
Ranz
Composition
50% SILICON, 20% Carbon, 30% metal oxide
Maximum Temperature Limit
300 degree C
Minimum Temperature Limit
-120
Model Name
Carbon Based Heat Sink Compound for PC,CPU,GPU,Chipset,VGA,LED,Processor,Ovens
Model Number
Syringe Thermal Silicon Conductiv Grease Paste G-360,Carbon Based Heat Sink
Net Quantity
20 g
Paste Color
Grey
Product Id
TRPH4V4FBJMGVGRX
Quantity
20 g
Specific Gravity
2.5
Suitable For
CPU, GPU, Processor, VGA, PC, Chipset, Ovens, Cooling, Other PC Components
Thermal Conductivity
1.93 W/mK
Thermal Resistance
0.225 Km2/W
Type
Carbon Based
Viscosity
200 Pa-s

Additonal Features

Key Features
High stability and reliability Apply to CPU,VGA,LED,Chipset,Processor and other Pc components., Low thermal resistance High conductivity for heat transfer, Compliance with RoHS REACH PFOS requirements Thermal conductivity:>1.96W/m-k, Thermal resistance:<0.225 °C-in ²/W Model:- G-360 Type:- Carbon based, Composition:- Aluminium Oxide,Zinc Oxide Quantity:- 20 Gram Colour:- Grey
Other Features
Easy To use Lightweight

Dimensions

Depth
2.6 inch
Width
1.96 inch
Height
1.96 inch
Other Dimensions
1.96 Length

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