Ranz HY510 Carbon Based Thermal Paste(30 g 1.93 W/mK)
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About this product
Introducing our high-quality thermal paste, specially designed for computer enthusiasts and professionals who demand top-notch cooling performance for their machines. Our thermal paste is made with premium materials and advanced formula to provide maximum heat transfer efficiency and optimal cooling performance. Our thermal paste is easy to apply, thanks to its smooth and non-conductive texture, which ensures a seamless and mess-free application. It's suitable for a wide range of computer components, including CPUs, GPUs, and heat sinks. It's also compatible with a wide range of materials, such as aluminium, copper, and brass. Our thermal paste is engineered to provide long-lasting performance and reliability, even under extreme temperatures and heavy usage. Its high thermal conductivity and low thermal resistance properties allow for maximum heat dissipation, resulting in a cooler and more stable system. In addition, our thermal paste is non-toxic, non-corrosive, and non-flammable, making it safe to use and handle. It's also RoHS compliant, which means it meets the highest standards of environmental safety. Overall, our thermal paste is an essential component for anyone who wants to ensure optimal cooling performance and longevity for their computer system. Try it today and experience the difference in your system's performance. • EASY TO USE
Specifications
General
- Key highlights
- EASY TO USE
- Additional details
- EASY TO USE
- Brand
- Electrosmart
- Composition
- Aluminum Oxide, Zinc Oxide, Silicon
- Maximum Temperature Limit
- 300 degree C
- Minimum Temperature Limit
- -120
- Model Name
- HY510
- Model Number
- Silicone Heatsink Compounds Cooling Processor CPU Graphics Carbon Based Thermal Paste
- Net Quantity
- 10 g
- Paste Color
- Grey
- Product Id
- TRPG49JXYCYBDZZJ
- Quantity
- 10 g
- Specific Gravity
- 2.1
- Suitable For
- CPU, Processor
- Thermal Conductivity
- 1.93 W/mK
- Thermal Resistance
- 1.93 Km2/W
- Type
- Carbon Based
- Viscosity
- 200 Pa-s
- Volatile Content
- 100 %
Additonal Features
- Key Features
- Density: Thermal paste should be dense enough to spread evenly on the processor and not leak., Thermal conductivity: High-grade thermal paste has a thermal conductivity of 8.5 W/mK., Thickness: For efficient heat transfer, a thermal paste with a thermal conductivity of 5 W/Mk should be 0.02mm thick., Electrical insulation: Thermal paste should be electrically insulative., Operating temperature: Thermal paste is electrically-insulating and non-corrosive with an operating temperature range of -40 to 200 °C.
- Other Features
- Easy to use
Dimensions
- Depth
- 2.6 inch
- Width
- 1.96 inch
- Height
- 1.96 inch
- Other Dimensions
- 1.96inch length
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