
Truebond
Truebond Thermal Pad 18.5 W/Mk Size (120MM*20MM) Silicone Pads Grey Thickness 0.5 MM Carbon Based Thermal Paste(160 g 70 W/mK)
Deal score 100/100· Excellent deal67% off MRP· Near 90-day low
Based on current discount vs MRP and price history — not product quality reviews.
Shipping & returns (retailer)
Fulfilled by Amazon India or Flipkart when you buy on their site. Details below match our structured data for each offer.
- FlipkartDelivery to India: 2–7 business days to IndiaTypical return window: up to 7 days (category-specific rules on retailer site). Return shipping usually paid by customer unless stated otherwise on checkout.Flipkart return policy
All-time low: ₹328 (last 90 days)
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About this product
A thermal pad is a type of thermally conductive material used to enhance heat transfer between components, such as CPUs, GPUs, or power electronics, and their heatsinks. They fill in microscopic gaps and irregularities, ensuring better contact and heat dissipation. • tharmal pad
Specifications
General
- Key highlights
- tharmal pad
- Additional details
- tharmal pad
- Brand
- Truebond
- Composition
- Silicone Pads with Apply for SSD CPU GPU LED
- Model Name
- Thermal Pad 18.5 W/Mk Size (120MM*20MM) Silicone Pads Grey Thickness 1 MM
- Model Number
- Thermal Pad Grey Thermal Pad Grey Thickness 0.5 MM
- Net Quantity
- 160 g
- Product Id
- TRPHG89XSGCUBBST
- Quantity
- 160 g
- Thermal Conductivity
- 70 W/mK
- Type
- Carbon Based
- Viscosity
- 70 Pa-s
Additonal Features
- Key Features
- Premium quality
- Other Features
- HEAT DISSIPATION: Premium aluminium thermal pad efficiently transfers and dissipates heat from electronic components for optimal cooling performance, DIMENSIONS: Measures 6 centimetres in length and 4 centimetres in width, perfect for standard computer cooling applications, VERSATILE USE: Compatible with various electronic components including CPUs, GPUs, and other heat-generating computer parts, DURABILITY: Constructed from high-grade aluminium material that resists wear and maintains consistent thermal conductivity, INSTALLATION: Features adhesive backing for quick and secure application to computer components
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