
TSE Silicone Thermal Compound Ceramic Based Thermal Paste(4 g 8.5 W/mK)
Based on current discount vs MRP and price history — not product quality reviews.
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About this product
Upgrade your CPU and GPU cooling performance with this high-quality Thermal Paste Compound (4g). Designed with a high-density silicone base and thermally conductive fillers, it ensures efficient heat transfer between processor and heat sink for stable system performance.The smooth, non-drip formula allows easy application and uniform spreading. Its non-conductive and non-corrosive composition makes it safe for use on CPUs, GPUs, chipsets, and other electronic components.Ideal for desktop computers, gaming PCs, laptops, and graphic cards, this thermal compound helps reduce overheating and improves long-term reliability.
Specifications
- Brand
- TSE
- Composition
- High-density silicone base with thermally conductive metal oxide fillers (Non-Conductive & Non-Corrosive).
- Model Name
- Silicone Thermal Compound
- Model Number
- HM501
- Net Quantity
- 4 g
- Product Id
- TRPHKWRXVQSNRXGT
- Quantity
- 4 g
- Thermal Conductivity
- 8.5 W/mK
- Type
- Ceramic Based
- Viscosity
- 80 Pa-s
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