TSE Silicone Thermal Compound Ceramic Based Thermal Paste(4 g 8.5 W/mK)
TSE

TSE Silicone Thermal Compound Ceramic Based Thermal Paste(4 g 8.5 W/mK)

Deal score 100/100· Excellent deal60% off MRP· Near 90-day low

Based on current discount vs MRP and price history — not product quality reviews.

BEST PRICE
Flipkart
In stock
₹238
60% off
₹599
Updated 36d ago
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    Delivery to India: 2–7 business days to IndiaTypical return window: up to 7 days (category-specific rules on retailer site). Return shipping usually paid by customer unless stated otherwise on checkout.
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All-time low: ₹238 (last 90 days)

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About this product

Upgrade your CPU and GPU cooling performance with this high-quality Thermal Paste Compound (4g). Designed with a high-density silicone base and thermally conductive fillers, it ensures efficient heat transfer between processor and heat sink for stable system performance.The smooth, non-drip formula allows easy application and uniform spreading. Its non-conductive and non-corrosive composition makes it safe for use on CPUs, GPUs, chipsets, and other electronic components.Ideal for desktop computers, gaming PCs, laptops, and graphic cards, this thermal compound helps reduce overheating and improves long-term reliability.

Specifications

Brand
TSE
Composition
High-density silicone base with thermally conductive metal oxide fillers (Non-Conductive & Non-Corrosive).
Model Name
Silicone Thermal Compound
Model Number
HM501
Net Quantity
4 g
Product Id
TRPHKWRXVQSNRXGT
Quantity
4 g
Thermal Conductivity
8.5 W/mK
Type
Ceramic Based
Viscosity
80 Pa-s

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